Responsibilities:
- Able to identify, develop and resolve process related issues for continuous improvement in yield, quality & reliability and productivity.
- Able to provide engineering solutions/support to assembly or test operations;
- Involved in process/test development and optimization for new device/package.
Requirements:
- Basic Degree in Electrical/Electronic/Mechanical Engineering or equivalent technology related qualification;
- Minimum 2-5 years’ experience in IC assembly manufacturing operations, preferably in Testing, Die Attach, Wirebond, Plating, Moulding, Marking or Trim & Form;
- A team player with strong analytical abilities, problem-solving skills in SPC, statistical data analysis and DOE will be an added advantage;
- Good leadership skills and an effective team player ;
- Good communication skills in English while Mandarin will be an added advantage;

